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이구산업 공시정보관리규정 다운로드

17

등록 특허 건수

특허보유현황
	특허명	특허번호	등록일
17	Automatic take-out and stacking device for plane material for multi-layer printed circuit board formation	10-2465129	2022-11-04
16	Method for forming the outermost layer of a multilayer printed circuit board	10-2436612	2022-08-23
15	Printed circuit board and its manufacturing method	10-2459414	2022-10-21
14	Photocurable ceramic composite ink composition and manufacturing method of printed circuit board using the same	10-2457877	2020-10-19
13	Cavity printed circuit board manufacturing method using sandblasting	10-2401424	2022-05-19
12	Method for removing release film of multi-layer printed circuit board	10-2384006	2022-04-04
11	Antenna-circuit board package	10-1780024	2017-09-13
10	Method for forming embedded trace board using direct circuit printing	10-2241371	2021-04-12
9	Manufacturing method of printed circuit board using 3D printing	10-2438657	2022-08-26
8	Hydrophobic 3D printing ink composition and manufacturing method thereof, and 3D inkjet printing method	10-2225126	2021-03-03
7	3D printing structure with continuous composition change and manufacturing method thereof	10-2308341	2021-09-28
6	Method of forming multilayer printed circuit board by 3D printing method	10-2218059	2021-02-15
5	Cavity formation method of printed circuit board using release film	10-2092818	2020-03-18
4	Method of forming a cavity of a printed circuit board	10-2092816	2020-03-18
3	Embedded type multilayer printed circuit board manufacturing method	10-2090926	2020-03-13
2	Test board and semiconductor chip intermediate device	10-1829327	2018-02-08
1	Manufacturing method of multi-layer printed circuit board having solder ball joint with improved joint reliability	10-1741794	2017-05-26

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